40 lines
1.3 KiB
C
40 lines
1.3 KiB
C
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#ifndef _FIRMWARE_PACK_H_
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#define _FIRMWARE_PACK_H_
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/*
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* 功能:
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* 因为固件都在V831这边，所以由V831来做升级的总管，控制升级流程
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* 1 从MT7682接收固件包, 写到V831的flash上面
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* 2 接收完毕，CRC正确，设置升级标志位，各个芯片要支持单独升级/单独设置升级标志/版本号
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* 3 触发V831的升级，升级完成，版本号与升级版本一致，清除V831的升级标志
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* 4 触发MT7682升级，升级完获取版本号，版本号与升级版本一致，清除MT7682升级标志
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* 5 类似方式触发BYD/华大升级
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*/
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/*
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* 每一个模块升级完都要单独更新升级标志
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*/
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enum FIRMWARE_ID {
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MAIN=0,
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SOUND,
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WIFI, //必须放在最后面, 因为写到flash以后, 就触发重启升级机制
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MCU2,
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CHIP_MAX
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};
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#define IMG_MAGIC 0x20A3BF9D
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struct chipFWInfo {
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unsigned int magic;
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unsigned short chipID; //FIRMWARE_ID
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unsigned short version; //待升级的版本号
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unsigned int offset; //在固件包当中的偏移地址
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unsigned int length; //固件大小
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unsigned int crc; //crc32
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};
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struct FWPackHeader{
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struct chipFWInfo FWInfo[CHIP_MAX];
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unsigned char reserved[128 - sizeof(struct chipFWInfo) * CHIP_MAX];
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};
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#endif
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